Ukusebenza okukhanyayo kobunzuluI-UV LEDngokuyininzi igqitywe yi-quantum ye-quantum yangaphandle, echaphazelekayo kwi-quantum yangaphakathi kunye nokusebenza kakuhle kokukhutshwa kokukhanya.Ngophuculo oluqhubekayo (> 80%) lwe-quantum yangaphakathi yokusebenza kwe-UV enzulu ye-UV, ukukhanya kokukhanya kwe-UV enzulu ye-LED ibe yinto ephambili ethintela ukuphuculwa kokukhanya kwe-UV ejulile ye-UV, kunye nokusebenza kakuhle kokukhutshwa kokukhanya I-LED ye-UV enzulu ichaphazeleka kakhulu yitekhnoloji yokupakisha.Itekhnoloji yokupakisha ye-UV enzulu ye-LED yahlukile kwitekhnoloji yangoku emhlophe yokupakisha ye-LED.I-LED emhlophe ipakishwe ikakhulu ngezinto eziphilayo (i-epoxy resin, i-silica gel, njl.njl.), kodwa ngenxa yobude bokukhanya okunzulu kwe-UV kunye namandla aphezulu, izinto eziphilayo ziya kuthotywa kwi-UV phantsi kwemitha ye-UV yexesha elide, echaphazela kakhulu. ukusebenza kakuhle kokukhanya kunye nokuthembeka kwe-UV LED enzulu.Ke ngoko, ukupakishwa okunzulu kwe-UV ye-LED kubaluleke kakhulu ekukhetheni izixhobo.

Izixhobo zokupakisha ze-LED ikakhulu zibandakanya izinto ezikhupha ukukhanya, izixhobo ze-substrate zokutshatyalaliswa kobushushu kunye nezixhobo zokubopha i-welding.Izinto ezikhupha ukukhanya zisetyenziselwa ukutsalwa kwe-chip luminescence, ukulawulwa kokukhanya, ukukhuselwa komatshini, njl.I-substrate yokutshatyalaliswa kobushushu isetyenziselwa ukudibanisa umbane we-chip, ukutshatyalaliswa kobushushu kunye nenkxaso yomatshini;Izixhobo zokudibanisa i-welding zisetyenziselwa ukuqinisa i-chip, i-lens bonding, njl.

1. imathiriyeli ekhupha ukukhanya:iUkukhanya kwe-LEDUlwakhiwo olukhuphayo luthatha izinto ezicacileyo zokuqonda ukukhanya kunye nohlengahlengiso, ngelixa likhusela itshiphu kunye nomaleko wesekethe.Ngenxa yokunganyangeki kakuhle kobushushu kunye ne-thermal conductivity ephantsi yezinto eziphilayo, ubushushu obuveliswa yi-chip ye-UV ye-LED enzulu buya kubangela ukuba ubushushu bomgangatho wokupakisha bunyuke, kwaye izinto eziphilayo ziya kuthotywa ubushushu, ukuguga kwe-thermal kunye ne-carbonization engaguqukiyo. phantsi kobushushu obuphezulu ixesha elide;Ukongeza, phantsi kwemitha ye-ultraviolet ephezulu yamandla, umaleko wokupakisha we-organic uya kuba neenguqu ezingaguqukiyo ezifana nokuncipha kokuhanjiswa kunye ne-microcracks.Ngokunyuka okuqhubekayo kwamandla e-UV anzulu, ezi ngxaki ziba nzulu ngakumbi, zenza kube nzima kwizinto zendalo zendalo ukuhlangabezana neemfuno zokupakishwa okunzulu kwe-UV LED.Ngokubanzi, nangona ezinye izinto eziphilayo ziye zaxelwa ukuba ziyakwazi ukumelana nokukhanya kwe-ultraviolet, ngenxa yokunganyangeki kobushushu kunye nokungangeni moya kwezinto eziphilayo, izinto eziphilayo zisanqongophele kwi-UV enzulu.Ukupakishwa kwe-LED.Ke ngoko, abaphandi bahlala bezama ukusebenzisa izinto ezingabonwayo ezinje ngeglasi yequartz kunye nesafire ukupakisha ubunzulu be-UV LED.

2. imathiriyeli yokulahla ubushushu:okwangoku, izixhobo ze-substrate zokutshatyalaliswa kobushushu be-LED ikakhulu ziquka i-resin, isinyithi kunye ne-ceramic.Zombini i-resin kunye ne-metal substrates ziqulethe i-organic resin insulation layer, eya kunciphisa ukuhanjiswa kwe-thermal ye-substrate yokutshatyalaliswa kobushushu kunye nokuchaphazela ukusebenza kokushisa kwe-substrate;Iisubstrates zeceramic ziquka ubukhulu becala ubushushu obuphezulu / obuphantsi co (HTCC/ltcc), ifilim eshinyeneyo yeceramic substrates (TPC), copper-clad ceramic substrates (DBC) kunye electroplated ceramic substrates (DPC).I-Ceramic substrates ineenzuzo ezininzi, njengamandla aphezulu omatshini, ukugquma okulungileyo, ukuhanjiswa okuphezulu kwe-thermal, ukumelana nokushisa okulungileyo, i-coefficient ephantsi yokwandiswa kwe-thermal kunye nokunye.Zisetyenziswa ngokubanzi kwipakethe yesixhobo samandla, ngakumbi ukupakishwa kwe-LED enamandla amakhulu.Ngenxa yokukhanya okuphantsi kokukhanya kwe-LED enzulu ye-UV, uninzi lwamandla ombane afakwayo aguqulwa abe bubushushu.Ukuze ugweme umonakalo ophezulu wokushisa kwi-chip ebangelwa ukushisa okugqithisileyo, ukushisa okwenziwa yi-chip kufuneka kukhutshwe kwindawo ejikelezileyo ngexesha.Nangona kunjalo, i-UV enzulu ye-LED ixhomekeke ikakhulu kwi-substrate yokulahla ubushushu njengendlela yokuqhuba ubushushu.Ke ngoko, i-thermal conductivity ephezulu ye-ceramic substrate lukhetho olulungileyo lwe-substrate yokulahla ubushushu kwipakethe enzulu ye-UV ye-LED.

3. imathiriyeli yokudibanisa i-welding:Izinto zokuwelda ezinzulu ze-UV ze-LED ziquka izixhobo zekristale eziqinileyo kunye ne-substrate welding materials, ezisetyenziswa ngokulandelelana ukuqaphela ukuwelda phakathi kwetshiphu, isigqubuthelo seglasi (i-lens) kunye ne-ceramic substrate.Kwi-flip chip, indlela yeGolide yeTin eutectic ihlala isetyenziselwa ukuqonda ukuqina kwetshiphu.Kwiitshiphusi ezithe tyaba kunye nezithe nkqo, iglu yesilivere eqhubayo kunye nentlama ye-solder engenalo i-lead ingasetyenziselwa ukugqibezela ukuqiniswa kwetshiphu.Xa kuthelekiswa neglu yesilivere kunye ne-lead-free solder paste, i-Gold Tin eutectic bonding amandla iphezulu, umgangatho wojongano ulungile, kunye ne-thermal conductivity ye-bonding layer iphezulu, enciphisa ukuxhathisa kwe-thermal ye-LED.Ipleyiti yesigqubuthelo seglasi idityaniswe emva kokuqiniswa kwetshiphu, ngoko ke ubushushu bokuwelda bukhawulwa bubushushu obuxhathisayo bomaleko wokuqiniswa kwetshiphu, ingakumbi ukudityaniswa ngokuthe ngqo kunye nokudibanisa i-solder.Ukudibanisa ngokuthe ngqo akufuni izinto ezidibanisayo eziphakathi.Ubushushu obuphezulu kunye nendlela yoxinzelelo oluphezulu isetyenziselwa ukugcwalisa ngokuthe ngqo i-welding phakathi kwesitya sokugubungela iglasi kunye ne-ceramic substrate.I-interface yokudibanisa i-flat kwaye inamandla amakhulu, kodwa ineemfuno eziphezulu zezixhobo kunye nolawulo lwenkqubo;I-solder bonding isebenzisa i-toti ephantsi yobushushu obusekelwe kwi-solder njengomaleko ophakathi.Ngaphantsi kwemeko yokufudumala kunye noxinzelelo, ukudibanisa kugqitywe ngokusasazwa kwe-athomu phakathi kwe-solder layer kunye nentsimbi yensimbi.Ubushushu benkqubo buphantsi kwaye ukusebenza kulula.Okwangoku, i-solder bonding ihlala isetyenziselwa ukuqonda ukuhlangana okuthembekileyo phakathi kweglasi yesigqubuthelo seglasi kunye ne-ceramic substrate.Nangona kunjalo, iileya zetsimbi kufuneka zilungiswe kumphezulu weplate yesigqubuthelo seglasi kunye ne-ceramic substrate ngaxeshanye ukuhlangabezana neemfuno zentsimbi yentsimbi, kunye nokukhethwa kwe-solder, i-solder yokugqoka, ukuphuphuma kwe-solder kunye nobushushu be-welding kufuneka kuthathelwe ingqalelo kwinkqubo yokudibanisa. .

Kwiminyaka yakutshanje, abaphandi basekhaya nakwamanye amazwe baye benza uphando olunzulu kwizinto ezinzulu zokupakisha ze-UV ze-LED, eziphucule ukusebenza okukhanyayo kunye nokuthembeka kwe-UV ye-UV enzulu ngokwembono yokupakisha iteknoloji yezinto, kwaye yakhuthaza ngokufanelekileyo ukuphuhliswa kwe-UV enzulu. Itekhnoloji ye-LED.