Yintoni iItshiphu ye-LED?Ngoko ke zithini iimpawu zayo?Ukwenziwa kweetshiphu ze-LEDubukhulu becala kukwenza i-electrode esebenzayo nethembekileyo ephantsi ye-ohm yoqhagamshelwano, ukuhlangabezana nokuhla kwamandla ombane amancinci phakathi kwezinto ezinokuqhagamshelwa, ukubonelela ngephedi yoxinzelelo lwentambo yokuwelda, kwaye kwangaxeshanye, ukukhanya okuninzi kangangoko kunokwenzeka.Inkqubo yenguqu yefilimu ngokuqhelekileyo isebenzisa indlela yokukhupha ivacuum.Ngaphantsi kwe-4Pa i-vacuum ephezulu, izinto ziyanyibilika ngokufudumeza kokumelana okanye ukufudumeza kwe-electron beam bombardment, kwaye i-BZX79C18 iguqulwe ibe ngumphunga wesinyithi ukuze idiphozithise kumphezulu wezinto ze-semiconductor phantsi koxinzelelo oluphantsi.

Iintsimbi ezisetyenziswa ngokuqhelekileyo zohlobo lwe-P ziquka i-AuBe, i-AuZn kunye nezinye i-alloys, kunye neentsimbi zoqhagamshelwano kwicala le-N zidla ngokuba yi-AuGeNi alloys.Umaleko we-alloyi owenziwe emva kokugquma kwakhona kufuneka uveze indawo ekhanyayo kangangoko kunokwenzeka ngefotografi, ukuze umaleko we-alloy oseleyo unokufikelela kwiimfuno ze-electrode esebenzayo kunye nethembekileyo ephantsi ye-ohm yoqhagamshelwano kunye ne-welding line pad.Emva kokuba inkqubo ye-photolithography igqityiwe, inkqubo ye-alloying iya kwenziwa phantsi kokhuseleko lwe-H2 okanye i-N2.Ixesha kunye nokushisa kwe-alloying ngokuqhelekileyo kunqunywe ngokweempawu zezixhobo ze-semiconductor kunye nefom yesithando somlilo we-alloy.Ngokuqinisekileyo, ukuba inkqubo ye-electrode ye-chip efana ne-blue-green inzima ngakumbi, ukukhula kwefilimu ye-passive kunye nenkqubo ye-plasma etching kufuneka yongezwe.

Kwinkqubo yokuvelisa i-chip ye-LED, zeziphi iinkqubo ezinempembelelo ebalulekileyo ekusebenzeni kwayo kwe-photoelectric?

Ngokuqhelekileyo, emva kokugqitywa kwemveliso ye-LED epitaxial, ukusebenza kwayo kombane kugqityiwe.Ukwenziwa kwetshiphu akuyi kutshintsha indalo yayo engundoqo yemveliso, kodwa iimeko ezingafanelekanga kwinkqubo yokwaleka kunye ne-alloying iya kubangela ukuba ezinye iiparamitha zombane zibe mbi.Umzekelo, ubushushu obuphantsi okanye obuphezulu be-alloying buya kubangela ukunxibelelana kwe-ohmic embi, esona sizathu siphambili sokuhla kwamandla ombane aphezulu we-VF kwimveliso ye-chip.Emva kokusika, ukuba inkqubo ethile yokudibanisa iqhutywe kumda we-chip, kuya kuba luncedo ukuphucula ukuvuza okubuyela emva kwe-chip.Oku kungenxa yokuba emva kokusika ngentsimbi yevili lokusila idayimani, kuya kubakho uthuli oluninzi olushiyekileyo kumphetho we-chip.Ukuba la maqhekeza anamathele kwi-PN junction ye-chip ye-LED, ziya kubangela ukuvuza kombane, okanye ukuphuka.Ukongeza, ukuba i-photoresist kwindawo ye-chip ayicolwanga ngokucokisekileyo, iya kubangela ubunzima phambi kokubopha ucingo kunye ne-solder yobuxoki.Ukuba ngumqolo, kuya kubangela ukuhla koxinzelelo oluphezulu.Kwinkqubo yokuveliswa kwetshiphu, ukukhanya kokukhanya kungaphuculwa ngokucocwa komphezulu kunye nokusikwa kwisakhiwo esiguqulweyo setrapezoid.

Kutheni iitshiphusi ze-LED zahlulwe ngokweesayizi ezahlukeneyo?Ziziphi iimpembelelo zobungakananiUmbane we-LEDukusebenza?

Ubungakanani be-chip ye-LED bunokwahlulwa lube yi-chip encinci yamandla, i-chip yamandla aphakathi kunye ne-chip yamandla aphezulu ngokwamandla.Ngokweemfuno zabathengi, inokwahlulwa ibe yinqanaba letyhubhu enye, inqanaba ledijithali, inqanaba le-lattice kunye nezibane zokuhombisa kunye nezinye iindidi.Ubungakanani obuthile be-chip buxhomekeke kwinqanaba lokwenyani lemveliso yabenzi beetshiphu ezahlukeneyo, kwaye akukho mfuneko ithile.Ngethuba nje inkqubo ifanelekile, i-chip inokuphucula imveliso yeyunithi kunye nokunciphisa iindleko, kwaye ukusebenza kweefoto zombane akuyi kutshintsha ngokusisiseko.Ikhoyo ngoku esetyenziswa yichip eneneni inxulumene noxinaniso lwangoku oluhamba ngetshiphu.Ikhoyo ngoku esetyenziswa yi-chip incinci kwaye yangoku esetyenziswa yi-chip inkulu.Uxinaniso lwangoku lweyunithi ngokusisiseko luyafana.Ukuqwalasela ukuba ukutshatyalaliswa kobushushu kuyingxaki ephambili phantsi kwangoku ophezulu, ukusebenza kwayo okukhanyayo kuphantsi kunoko kuphantsi kwangoku.Ngakolunye uhlangothi, njengoko ummandla ukhula, ukuchasana komthamo we-chip kuya kuncipha, ngoko i-voltage conduction yangaphambili iya kuncipha.

Yeyiphi isayizi yechip i-LED ephezulu yamandla ebhekisa kuyo ngokubanzi?Ngoba?

Iichips ze-LED ezisetyenziselwa ukukhanya okumhlophe ngokubanzi zinokubonwa kwimarike malunga ne-40 mils, kwaye okubizwa ngokuba ziitshiphusi zamandla aphezulu kuthetha ukuba amandla ombane angaphezulu kwe-1W.Ekubeni ukusebenza kakuhle kwe-quantum ngokuqhelekileyo kungaphantsi kwe-20%, uninzi lwamandla ombane luya kuguqulwa lube ngamandla obushushu, ngoko ke ukuchithwa kobushushu kwee-chips eziphezulu zamandla kubaluleke kakhulu, kufuna indawo enkulu ye-chip.

Ziziphi iimfuno ezahlukeneyo zenkqubo ye-chip kunye nezixhobo zokusebenza zokuvelisa i-GaN epitaxial materials xa kuthelekiswa ne-GaP, i-GaAs kunye ne-InGaAlP?Ngoba?

Ii-substrates ze-LED eziqhelekileyo ezibomvu kunye ne-yellow chips kunye ne-quaternary eqaqambileyo ebomvu kunye ne-yellow chips zenziwe nge-GaP, i-GaAs kunye nezinye izinto ezidibeneyo ze-semiconductor, ezinokuthi zenziwe ngokubanzi kwi-N-type substrates.Inkqubo emanzi isetyenziselwa i-photolithography, kwaye kamva i-blade yevili ledayimani isetyenziselwa ukusika kwiichips.I-chip eluhlaza okwesibhakabhaka yezinto ze-GaN yi-sapphire substrate.Ngenxa yokuba i-sapphire substrate ifakwe i-insulated, ayikwazi ukusetyenziswa njengepali ye-LED.I-electrodes ye-P/N kufuneka yenziwe kwi-epitaxial surface ngaxeshanye ngenkqubo eyomileyo yokubhala kunye nangezinye iinkqubo zokudlula.Ngenxa yokuba iisafire zinzima kakhulu, kunzima ukusika iitshiphusi ngeencakuba zamavili okusila idayimane.Inkqubo yayo ngokuqhelekileyo inzima ngakumbi kune-GaP kunye ne-GaAs LEDs.

Yintoni isakhiwo kunye neempawu ze-chip "ebonakalayo ye-electrode"?

I-electrode ebizwa ngokuba yi-transparent electrode kufuneka ikwazi ukuqhuba umbane kunye nokukhanya.Esi sixhobo ngoku sisetyenziswa ngokubanzi kwinkqubo yokuvelisa ikristale yolwelo.Igama layo yi-Indium Tin Oxide (ITO), kodwa ayinakusetyenziswa njenge-welding pad.Ngexesha lokwenziwa, i-electrode ye-ohmic iya kwenziwa kwi-chip surface, kwaye ke umaleko we-ITO uya kugqunywa phezu komhlaba, kwaye emva koko umgca we-welding pad uya kufakwa kwi-ITO surface.Ngale ndlela, i-current evela kwi-lead ihanjiswa ngokulinganayo kwi-electrode nganye yoqhagamshelwano lwe-ohmic ngokusebenzisa i-ITO layer.Ngelo xesha, ekubeni isalathisi se-ITO esihlaziyayo siphakathi komoya kunye nesalathisi se-refractive sezinto ze-epitaxial, i-angle yokukhanya inokunyuswa, kwaye i-flux ekhanyayo inokunyuswa.

Yintoni eyona nto iphambili yetekhnoloji ye-chip yokukhanyisa kwe-semiconductor?

Ngophuhliso lwethekhnoloji ye-LED ye-semiconductor, izicelo zayo kwintsimi yokukhanyisa zininzi ngakumbi, ngakumbi ukuvela kwe-LED emhlophe, eye yaba yingqwalasela yokukhanya kwe-semiconductor.Nangona kunjalo, i-chip ephambili kunye netekhnoloji yokupakisha isafuna ukuphuculwa, kwaye i-chip kufuneka iphuhliswe ukuya kumandla aphezulu, ukusebenza kakuhle okukhanyayo kunye nokumelana nobushushu obuphantsi.Ukwandisa amandla kuthetha ukwandisa i-current esetyenziswa yi-chip.Indlela ethe ngqo kukwandisa ubungakanani betshiphu.Namhlanje, ii-chips zamandla aphezulu zizonke ziyi-1mm × 1mm, kwaye okwangoku yi-350mA Ngenxa yokunyuka kokusetyenziswa kwangoku, ingxaki yokutshatyalaliswa kobushushu ibe yingxaki evelele.Ngoku le ngxaki isonjululwe ngokusisiseko nge-chip flip.Ngophuhliso lwethekhnoloji ye-LED, ukusetyenziswa kwayo kwintsimi yokukhanyisa kuya kujongana nethuba elingazange libonwe ngaphambili kunye nomngeni.

Yintoni iFlip Chip?Siyintoni isakhiwo sayo?Ziziphi iingenelo zayo?

I-LED eluhlaza okwesibhakabhaka isebenzisa i-Al2O3 substrate.I-Al2O3 substrate inobunzima obuphezulu, i-conductivity ephantsi ye-thermal kunye ne-conductivity.Ukuba isakhiwo esihle sisetyenzisiweyo, kwelinye icala, siya kubangela iingxaki ezichasene ne-static, ngakolunye uhlangothi, ukutshatyalaliswa kobushushu kuya kuba yingxaki enkulu phantsi kweemeko eziphezulu zangoku.Ngelo xesha, ngenxa yokuba i-electrode yangaphambili ijonge phezulu, inxalenye yokukhanya iya kuvalwa, kwaye ukukhanya okukhanyayo kuya kuncitshiswa.Amandla aphezulu aluhlaza we-LED anokufumana ukukhanya okusebenzayo ngakumbi kunetekhnoloji yokupakisha yemveli ngokusebenzisa itekhnoloji ye-chip flip chip.

Indlela yangoku yolwakhiwo oluqhelekileyo lwe-flip yile: okokuqala, lungiselela ubungakanani obukhulu be-LED chip kunye ne-eutectic welding electrode efanelekileyo, kwangaxeshanye, lungisa i-silicon substrate enkulu kancinane kune-chip ye-LED eluhlaza, kwaye uvelise umaleko wegolide kunye nocingo olukhokelayo. umaleko (i-ultrasonic igolide yebhola yebhola ye-solder joint) ye-eutectic welding.Emva koko, i-chip ye-LED enamandla aphezulu kunye ne-silicon substrate idityaniswe kunye kusetyenziswa izixhobo zokuwelda ze-eutectic.

Esi sakhiwo sibonakaliswe kukuba i-epitaxial layer idibanisa ngokuthe ngqo kunye ne-silicon substrate, kwaye ukuxhathisa kwe-thermal ye-silicon substrate iphantsi kakhulu kune-sapphire substrate, ngoko ke ingxaki yokutshatyalaliswa kobushushu isonjululwe kakuhle.Ekubeni i-substrate yesafire ijonge phezulu emva kokuguqulwa, iba yindawo ekhupha ukukhanya.Isafire iyabonakala, ngoko ke ingxaki yokukhupha ukukhanya nayo iyasonjululwa.Oku ngasentla kulwazi olufanelekileyo lweteknoloji ye-LED.Ndiyakholelwa ukuba ngophuhliso lwesayensi kunye nobuchwepheshe, izibane ze-LED kwixesha elizayo ziya kuba zisebenza ngakumbi nangakumbi, kwaye ubomi babo benkonzo buya kuphuculwa kakhulu, zisizise lula.