Yintoni iItshiphu ye-LED? Ngoko ke zithini iimpawu zayo?Ukwenziwa kweetshiphu ze-LEDikakhulu kukwenza i-electrode esebenzayo nethembekileyo ephantsi ye-ohm yoqhagamshelwano, ukuhlangabezana nokuhla kwamandla ombane amancinci phakathi kwezinto ezinokuqhagamshelwana nazo, ukubonelela ngephedi yoxinzelelo lwentambo yokuwelda, kwaye kwangaxeshanye, ukukhanya okuninzi kangangoko kunokwenzeka. Inkqubo yenguqu yefilimu ngokuqhelekileyo isebenzisa indlela yokukhupha ivacuum. Ngaphantsi kwe-4Pa i-vacuum ephezulu, izinto zinyibilika ngokufudumeza kokumelana okanye ukufudumeza kwe-electron beam bombardment, kwaye i-BZX79C18 iguqulwe ibe ngumphunga wesinyithi ukuze idiphozithise kumphezulu wezinto ze-semiconductor phantsi koxinzelelo oluphantsi.

Iintsimbi ezisetyenziswa ngokuqhelekileyo zohlobo lwe-P ziquka i-AuBe, i-AuZn kunye nezinye i-alloys, kunye neentsimbi zoqhagamshelwano kwicala le-N zidla ngokuba yi-AuGeNi alloys. Umaleko we-alloyi owenziwe emva kokugquma kwakhona kufuneka uveze indawo ekhanyayo kangangoko kunokwenzeka ngefotografi, ukuze umaleko we-alloy oseleyo unokufikelela kwiimfuno ze-electrode esebenzayo kunye nethembekileyo ephantsi ye-ohm yoqhagamshelwano kunye ne-welding line pad. Emva kokuba inkqubo ye-photolithography igqityiwe, inkqubo ye-alloying iya kwenziwa phantsi kokhuseleko lwe-H2 okanye i-N2. Ixesha kunye nokushisa kwe-alloying ngokuqhelekileyo kunqunywe ngokweempawu zezixhobo ze-semiconductor kunye nefom yesithando somlilo we-alloy. Ngokuqinisekileyo, ukuba inkqubo ye-electrode ye-chip efana ne-blue-green inzima ngakumbi, ukukhula kwefilimu ye-passive kunye nenkqubo ye-plasma etching kufuneka yongezwe.

Kwinkqubo yokuvelisa i-chip ye-LED, zeziphi iinkqubo ezinempembelelo ebalulekileyo ekusebenzeni kwayo kwe-photoelectric?

Ngokuqhelekileyo, emva kokugqitywa kwemveliso ye-LED epitaxial, ukusebenza kwayo kombane kugqityiwe. Ukwenziwa kwetshiphu akuyi kutshintsha indalo yayo engundoqo yemveliso, kodwa iimeko ezingafanelekanga kwinkqubo yokwaleka kunye ne-alloying iya kubangela ukuba ezinye iiparamitha zombane zibe mbi. Umzekelo, ubushushu obuphantsi okanye obuphezulu be-alloying buya kubangela ukunxibelelana kwe-ohmic embi, esona sizathu siphambili sokuhla kwamandla ombane aphezulu we-VF kwimveliso ye-chip. Emva kokusika, ukuba inkqubo ethile yokudibanisa iqhutywe kumda we-chip, kuya kuba luncedo ukuphucula ukuvuza okubuyela emva kwe-chip. Oku kungenxa yokuba emva kokusika ngentsimbi yevili lokusila idayimani, kuya kubakho uthuli oluninzi olushiyekileyo kumphetho we-chip. Ukuba la maqhekeza anamathele kwi-PN junction ye-chip ye-LED, ziya kubangela ukuvuza kombane, okanye ukuphuka. Ukongeza, ukuba i-photoresist kwindawo ye-chip ayicolwanga ngokucokisekileyo, iya kubangela ubunzima phambi kokubopha ucingo kunye ne-solder yobuxoki. Ukuba ngumqolo, kuya kubangela ukuhla koxinzelelo oluphezulu. Kwinkqubo yokuveliswa kwetshiphu, ukukhanya kokukhanya kungaphuculwa ngokucocwa komphezulu kunye nokusikwa kwisakhiwo esiguqulweyo setrapezoid.

Kutheni iitshiphusi ze-LED zahlulwe ngokweesayizi ezahlukeneyo? Ziziphi iimpembelelo zobungakananiUmbane we-LEDukusebenza?

Ubungakanani be-chip ye-LED bunokwahlulwa lube yi-chip encinci yamandla, i-chip yamandla aphakathi kunye ne-chip yamandla aphezulu ngokwamandla. Ngokweemfuno zabathengi, inokwahlulwa ibe yinqanaba letyhubhu enye, inqanaba ledijithali, inqanaba le-lattice kunye nezibane zokuhombisa kunye nezinye iindidi. Ubungakanani obuthile be-chip buxhomekeke kwinqanaba lokwenyani lemveliso yabenzi beetshiphu ezahlukeneyo, kwaye akukho mfuneko ithile. Ngethuba nje inkqubo ifanelekile, i-chip inokuphucula imveliso yeyunithi kunye nokunciphisa iindleko, kwaye ukusebenza kweefoto zombane akuyi kutshintsha ngokusisiseko. Ikhoyo ngoku esetyenziswa yichip eneneni inxulumene noxinaniso lwangoku oluhamba ngetshiphu. Ikhoyo ngoku esetyenziswa yi-chip incinci kwaye yangoku esetyenziswa yi-chip inkulu. Uxinaniso lwangoku lweyunithi ngokusisiseko luyafana. Ukuqwalasela ukuba ukutshatyalaliswa kobushushu kuyingxaki ephambili phantsi kwangoku ophezulu, ukusebenza kwayo okukhanyayo kuphantsi kunoko kuphantsi kwangoku. Ngakolunye uhlangothi, njengoko ummandla ukhula, ukuchasana komthamo we-chip kuya kuncipha, ngoko i-voltage conduction yangaphambili iya kuncipha.

Yeyiphi isayizi yechip i-LED ephezulu yamandla ebhekisa kuyo ngokubanzi? Ngoba?

Iichips ze-LED ezisetyenziselwa ukukhanya okumhlophe ngokubanzi zinokubonwa kwimarike malunga ne-40 mils, kwaye okubizwa ngokuba ziitshiphusi zamandla aphezulu kuthetha ukuba amandla ombane angaphezulu kwe-1W. Ekubeni ukusebenza kakuhle kwe-quantum ngokuqhelekileyo kungaphantsi kwe-20%, uninzi lwamandla ombane luya kuguqulwa lube ngamandla obushushu, ngoko ke ukuchithwa kobushushu kwee-chips eziphezulu zamandla kubaluleke kakhulu, kufuna indawo enkulu ye-chip.

Ziziphi iimfuno ezahlukeneyo zenkqubo ye-chip kunye nezixhobo zokusebenza zokuvelisa i-GaN epitaxial materials xa kuthelekiswa ne-GaP, i-GaAs kunye ne-InGaAlP? Ngoba?

Ii-substrates ze-LED eziqhelekileyo ezibomvu kunye ne-yellow chips kunye ne-quaternary eqaqambileyo ebomvu kunye ne-yellow chips zenziwe nge-GaP, i-GaAs kunye nezinye izinto ezidibeneyo ze-semiconductor, ezinokuthi zenziwe ngokubanzi kwi-N-type substrates. Inkqubo emanzi isetyenziselwa i-photolithography, kwaye kamva i-blade yevili ledayimani isetyenziselwa ukusika kwiichips. I-chip eluhlaza okwesibhakabhaka yezinto ze-GaN yi-sapphire substrate. Ngenxa yokuba i-sapphire substrate ifakwe i-insulated, ayikwazi ukusetyenziswa njengepali ye-LED. I-electrodes ye-P/N kufuneka yenziwe kwi-epitaxial surface ngaxeshanye ngenkqubo eyomileyo yokubhala kunye nangezinye iinkqubo zokudlula. Ngenxa yokuba iisafire zinzima kakhulu, kunzima ukusika iitshiphusi ngeencakuba zamavili okusila idayimane. Inkqubo yayo ngokuqhelekileyo inzima ngakumbi kune-GaP kunye ne-GaAs LEDs.

Yintoni isakhiwo kunye neempawu ze-chip "ebonakalayo ye-electrode"?

I-electrode ebizwa ngokuba yi-transparent electrode kufuneka ikwazi ukuqhuba umbane kunye nokukhanya. Esi sixhobo ngoku sisetyenziswa ngokubanzi kwinkqubo yokuvelisa ikristale elulwelo. Igama layo yi-Indium Tin Oxide (ITO), kodwa ayinakusetyenziswa njenge-welding pad. Ngexesha lokwenziwa, i-electrode ye-ohmic iya kwenziwa kwi-chip surface, kwaye ke umaleko we-ITO uya kugqunywa phezu komhlaba, kwaye emva koko umgca we-welding pad uya kufakwa kwi-ITO surface. Ngale ndlela, i-current evela kwi-lead ihanjiswa ngokulinganayo kwi-electrode nganye yoqhagamshelwano lwe-ohmic ngokusebenzisa i-ITO layer. Ngelo xesha, ekubeni isalathisi se-ITO esihlaziyayo siphakathi komoya kunye nesalathisi se-refractive sezinto ze-epitaxial, i-angle yokukhanya inokunyuswa, kwaye i-flux ekhanyayo inokunyuswa.

Yintoni eyona nto iphambili yetekhnoloji ye-chip yokukhanyisa kwe-semiconductor?

Ngophuhliso lwethekhnoloji ye-LED ye-semiconductor, izicelo zayo kwintsimi yokukhanyisa zininzi ngakumbi, ngakumbi ukuvela kwe-LED emhlophe, eye yaba yingqwalasela yokukhanya kwe-semiconductor. Nangona kunjalo, i-chip ephambili kunye netekhnoloji yokupakisha isafuna ukuphuculwa, kwaye i-chip kufuneka iphuhliswe ukuya kumandla aphezulu, ukusebenza kakuhle okukhanyayo kunye nokumelana nobushushu obuphantsi. Ukwandisa amandla kuthetha ukwandisa i-current esetyenziswa yi-chip. Indlela ethe ngqo kukwandisa ubungakanani betshiphu. Namhlanje, ii-chips zamandla aphezulu zizonke ziyi-1mm × 1mm, kwaye okwangoku yi-350mA Ngenxa yokunyuka kokusetyenziswa kwangoku, ingxaki yokutshatyalaliswa kobushushu ibe yingxaki evelele. Ngoku le ngxaki isonjululwe ngokusisiseko nge-chip flip. Ngophuhliso lwethekhnoloji ye-LED, ukusetyenziswa kwayo kwintsimi yokukhanyisa kuya kujongana nethuba elingazange libonwe ngaphambili kunye nomngeni.

Yintoni iFlip Chip? Siyintoni isakhiwo sayo? Ziziphi iingenelo zayo?

I-LED eluhlaza okwesibhakabhaka isebenzisa i-Al2O3 substrate. I-Al2O3 substrate inobunzima obuphezulu, i-conductivity ephantsi ye-thermal kunye ne-conductivity. Ukuba isakhiwo esihle sisetyenzisiweyo, kwelinye icala, siya kubangela iingxaki ezichasene ne-static, ngakolunye uhlangothi, ukutshatyalaliswa kobushushu kuya kuba yingxaki enkulu phantsi kweemeko eziphezulu zangoku. Ngelo xesha, ngenxa yokuba i-electrode yangaphambili ijonge phezulu, inxalenye yokukhanya iya kuvalwa, kwaye ukukhanya okukhanyayo kuya kuncitshiswa. Amandla aphezulu eblue LED anokufumana ukukhanya okusebenzayo ngakumbi kunetekhnoloji yokupakisha yemveli ngokusebenzisa itekhnoloji ye-chip flip chip.

Indlela yangoku yolwakhiwo oluqhelekileyo lwe-flip yile: okokuqala, lungiselela ubungakanani obukhulu be-LED chip kunye ne-eutectic welding electrode efanelekileyo, kwangaxeshanye, lungisa i-silicon substrate enkulu kancinane kune-chip ye-LED eluhlaza, kwaye uvelise umaleko wegolide kunye nocingo olukhokelayo. umaleko (i-ultrasonic igolide yebhola yebhola ye-solder joint) ye-eutectic welding. Emva koko, i-chip ye-LED enamandla aphezulu kunye ne-silicon substrate idityaniswe kunye kusetyenziswa izixhobo zokuwelda ze-eutectic.

Esi sakhiwo sibonakaliswe kukuba i-epitaxial layer idibanisa ngokuthe ngqo kunye ne-silicon substrate, kwaye ukuxhathisa kwe-thermal ye-silicon substrate iphantsi kakhulu kune-sapphire substrate, ngoko ke ingxaki yokutshatyalaliswa kobushushu isonjululwe kakuhle. Ekubeni i-substrate yesafire ijonge phezulu emva kokuguqulwa, iba yindawo ekhupha ukukhanya. Isafire iyabonakala, ngoko ke ingxaki yokukhupha ukukhanya nayo iyasonjululwa. Oku ngasentla kulwazi olufanelekileyo lweteknoloji ye-LED. Ndiyakholelwa ukuba ngophuhliso lwesayensi kunye nobuchwepheshe, izibane ze-LED kwixesha elizayo ziya kuba zisebenza ngakumbi nangakumbi, kwaye ubomi babo benkonzo buya kuphuculwa kakhulu, zisizise lula.