Yintoni itshiphu ye-LED? Ngoko ke zithini iimpawu zayo? Eyona njongo iphambili yokwenziwa kwetshiphu ye-LED kukwenza ii-electrode zoqhagamshelwano ezisebenzayo nezithembekileyo ze-ohm, kunye nokuhlangabezana nokuhla kwamandla ombane omncinci ngokwentelekiso phakathi kwezinto ezinokuqhagamshelwana nazo kunye nokubonelela ngeepadi zoxinzelelo kwiingcingo zokuthengisela, ngelixa unyusa umthamo wokukhanya. Inkqubo yefilimu enqamlezayo ngokuqhelekileyo isebenzisa indlela yokukhupha i-vacuum. Ngaphantsi kwe-vacuum ephezulu ye-4Pa, izinto eziphathekayo ziyancibilika ngokufudumeza kokumelana okanye i-electron beam bombardment yokufudumeza indlela yokufudumeza, kwaye i-BZX79C18 iguqulwa ibe ngumphunga wensimbi kwaye ifakwe kumphezulu wezinto ze-semiconductor phantsi koxinzelelo oluphantsi.
Iintsimbi ezisetyenziswa ngokuqhelekileyo zohlobo lwe-P ziquka i-alloys ezifana ne-AuBe kunye ne-AuZn, ngelixa isinyithi soqhagamshelwano kwicala le-N sihlala senziwe nge-alloy ye-AuGeNi. Umaleko we-alloy owenziwe emva kokugquma kwakhona kufuneka utyhileke kangangoko kunokwenzeka kwindawo ye-luminescent ngokusebenzisa inkqubo ye-photolithography, ukwenzela ukuba i-alloy layer eseleyo ikwazi ukuhlangabezana neemfuno ze-electrode zoqhagamshelwano ezisebenzayo kunye nezithembekileyo ze-ohm kunye ne-solder wire pressure pads. Emva kokuba inkqubo ye-photolithography igqityiwe, iphinda ifune ukuhamba kwinkqubo ye-alloying, edla ngokuqhutyelwa phantsi kokhuseleko lwe-H2 okanye i-N2. Ixesha kunye nokushisa kwe-alloying ngokuqhelekileyo kunqunywe yimiba efana neempawu zezixhobo ze-semiconductor kunye nefom yesithando somlilo we-alloy. Ngokuqinisekileyo, ukuba i-blue-green kunye nezinye iinkqubo ze-electrode ze-chip zinzima ngakumbi, kuyimfuneko ukongeza ukukhula kwefilimu ye-passivation, iinkqubo ze-plasma etching, njl.
Kwinkqubo yokwenziwa kwee-chips ze-LED, zeziphi iinkqubo ezinempembelelo enkulu ekusebenzeni kwazo kwe-optoelectronic?
Ngokuqhelekileyo, emva kokugqitywa kwemveliso ye-epitaxial ye-LED, ukusebenza kwayo kombane okuphambili kugqityiwe, kwaye ukuveliswa kwe-chip akutshintshi indalo yayo yokuvelisa. Nangona kunjalo, iimeko ezingafanelekanga ngexesha lokwaleka kunye nenkqubo yokudibanisa inokubangela ukuba ezinye iiparitha zombane zibe mbi. Umzekelo, ubushushu obuphantsi okanye obuphezulu be-alloying bunokubangela ukudibana okungalunganga kwe-Ohmic, eyona nto ingunobangela wokuhla kwamandla ombane aphezulu we-VF kwimveliso ye-chip. Emva kokusika, ezinye iinkqubo ze-corrosion kwimida ye-chip zinokuba luncedo ekuphuculeni ukuvuza okubuyela emva kwe-chip. Oku kungenxa yokuba emva kokusika ngentsimbi yevili lokusila idayimani, kuya kubakho inkunkuma eninzi eseleyo kunye nomgubo kumda wetshiphu. Ukuba la maqhekeza anamathele kwi-PN junction ye-chip ye-LED, ziya kubangela ukuvuza kombane kunye nokuphuka. Ukongeza, ukuba i-photoresist kumphezulu we-chip ayicolwanga ngokucocekileyo, iya kubangela ubunzima phambi kwe-soldering kunye ne-solder ebonakalayo. Ukuba isemva, iya kubangela ukuhla koxinzelelo oluphezulu. Ngexesha lenkqubo yokuvelisa i-chip, ukurhaxa komhlaba kunye nezakhiwo zetrapezoidal zingasetyenziselwa ukwandisa ukukhanya.
Kutheni iitshiphusi ze-LED kufuneka zahlulwe ngokweesayizi ezahlukeneyo? Ithini impembelelo yobungakanani ekusebenzeni kwe-LED optoelectronic?
Iichips ze-LED zinokwahlulwa zibe ziitshiphusi ezinamandla aphantsi, iitshiphusi zamandla aphakathi, kunye neetshiphusi zamandla aphezulu ezisekwe kumandla. Ngokweemfuno zabathengi, inokwahlulwa ngokweendidi ezinje ngenqanaba letyhubhu enye, inqanaba ledijithali, inqanaba lematrix yamachaphaza, kunye nezibane zokuhombisa. Ngokubhekiselele kubungakanani obuthile be-chip, kuxhomekeke kwinqanaba lokwenyani lokuvelisa abavelisi be-chip abahlukeneyo kwaye akukho zidingo ezithile. Ngethuba nje inkqubo idlulisiwe, i-chip inokunyusa imveliso yeyunithi kunye nokunciphisa iindleko, kwaye ukusebenza kwe-photoelectric akuyi kutshintsha utshintsho olusisiseko. Umjelo osetyenziswa yitshiphu ngokwenene unxulumene noxinaniso lwangoku oluhamba ngetshiphu. I-chip encinci isebenzisa i-current encinci, ngelixa i-chip enkulu isebenzisa ngakumbi yangoku, kunye noxinaniso lweyunithi lwangoku luyafana. Ukuqwalasela ukuba ukutshatyalaliswa kobushushu kuyingxaki ephambili phantsi kwangoku ophezulu, ukusebenza kwayo okukhanyayo kuphantsi kunoko kuphantsi kwangoku. Ngakolunye uhlangothi, njengoko ummandla ukhula, ukuchasana komzimba we-chip kuya kuncipha, kubangele ukuhla kwe-voltage conduction yangaphambili.

Yeyiphi indawo ngokubanzi yeechips ze-LED eziphezulu zamandla? Ngoba?
Iichips ze-LED ezinamandla aphezulu ezisetyenziselwa ukukhanya okumhlophe zibonwa ngokubanzi kwimarike malunga ne-40mil, kwaye amandla asetyenziselwa iitshiphusi zamandla aphezulu abhekisa kumandla ombane angaphezulu kwe-1W. Ngenxa yokusebenza kakuhle komyinge ngokuqhelekileyo ungaphantsi kwe-20%, amandla amaninzi ombane aguqulwa abe ngumbane oshushu, ngoko ukuchithwa kobushushu kubalulekile kwiitshiphusi zamandla aphezulu, zifuna ukuba zibe nendawo enkulu.
Ziziphi iimfuno ezahlukeneyo zeteknoloji ye-chip kunye nezixhobo zokusebenza zokuvelisa izinto ze-GaN epitaxial xa kuthelekiswa ne-GaP, i-GaAs, kunye ne-InGaAlP? Ngoba?
Ii-substrates ze-LED eziqhelekileyo ezibomvu kunye ne-yellow chips kunye nokukhanya okuphezulu kwe-quaternary ebomvu kunye ne-yellow chips zombini zisebenzisa izinto ezidibeneyo ze-semiconductor ezifana ne-GaP kunye ne-GaAs, kwaye ngokubanzi zingenziwa zibe yi-N-type substrates. Ukusebenzisa inkqubo emanzi yephotolithography, kwaye kamva ukusika kwiitshiphusi usebenzisa iiblade zevili lokusila idayimani. I-chip eluhlaza okwesibhakabhaka eyenziwe ngezinto ze-GaN isebenzisa i-sapphire substrate. Ngenxa yobume be-insulating ye-sapphire substrate, ayinakusetyenziswa njenge-electrode ye-LED. Ngoko ke, zombini ii-electrodes ze-P / N kufuneka zenziwe kwi-epitaxial surface nge-etching eyomileyo kwaye ezinye iinkqubo zokupasa kufuneka zenziwe. Ngenxa yokuqina kwesafire, kunzima ukusika kwiitshiphusi ezinamavili amavili okugaya idayimane. Inkqubo yokwenziwa kwayo ngokuqhelekileyo intsonkothe ​​ngakumbi kunaleyo ye-GaP kunye ne-GaAs materials forIzibane ze-LED.

Yintoni isakhiwo kunye neempawu ze-chip "ebonakalayo ye-electrode"?
I-electrode ebizwa ngokuba yi-transparent electrode kufuneka ikwazi ukuqhuba umbane kwaye ikwazi ukuhambisa ukukhanya. Esi sixhobo ngoku sisetyenziswa ngokubanzi kwiinkqubo zokuvelisa i-crystal yamanzi, kwaye igama layo yi-indium tin oxide, efinyeziweyo njenge-ITO, kodwa ayinakusetyenziswa njenge-solder pad. Xa usenza, kuyimfuneko ukuba uqale ulungiselele i-electrode ye-ohmic ebusweni be-chip, emva koko ugubungele ubuso kunye noluhlu lwe-ITO, uze ufake i-solder pads kwi-ITO surface. Ngale ndlela, ikhoyo ngoku ehlayo ukusuka kwintambo ekhokelayo isasazwa ngokulinganayo kuwo wonke umaleko we-ITO kwi-electrode nganye yoqhagamshelwano lwe-ohmic. Ngexesha elifanayo, ngenxa yesalathiso se-refractive ye-ITO phakathi komoya kunye ne-refractive index ye-epitaxial material, i-angle yokukhanya inokunyuswa, kwaye ukukhanya okukhanyayo kunokunyuswa.

Luluphi uphuhliso oluphambili lwetekhnoloji ye-chip yokukhanyisa kwe-semiconductor?
Ngophuhliso lwethekhnoloji ye-LED ye-semiconductor, ukusetyenziswa kwayo kwintsimi yokukhanyisa kwanda, ngakumbi ukuvela kwe-LED emhlophe, eye yaba yinto eshushu ekukhanyeni kwe-semiconductor. Nangona kunjalo, iitshiphusi eziphambili kunye nobuchwepheshe bokupakisha zisafuna ukuphuculwa, kwaye ukuphuhliswa kweechips kufuneka kugxininise kumandla aphezulu, ukukhanya okuphezulu, kunye nokunciphisa ukuxhathisa ukushisa. Ukwandisa amandla kuthetha ukwandisa ukusetyenziswa kwangoku kwetshiphu, kwaye indlela ethe ngqo kukwandisa ubungakanani betshiphu. Iitshiphusi ezisetyenziswa ngokuqhelekileyo ezinamandla aphezulu zijikeleze i-1mm x 1mm, kunye nosetyenziso lwangoku lwe-350mA. Ngenxa yokunyuka kokusetyenziswa kwangoku, ukutshatyalaliswa kobushushu kuye kwaba yingxaki evelele. Ngoku, indlela ye-chip inversion iyisombulule le ngxaki. Ngophuhliso lwethekhnoloji ye-LED, ukusetyenziswa kwayo kwintsimi yokukhanyisa kuya kujongana namathuba angazange abonwe ngaphambili kunye nemingeni.
Yintoni itshiphu eguqulweyo? Luthini ulwakhiwo lwaso kwaye zeziphi iingenelo zalo?
Ii-LED zokukhanya okuluhlaza ngokuqhelekileyo zisebenzisa i-Al2O3 substrates, ezinobunzima obuphezulu, i-conductivity ephantsi ye-thermal, kunye ne-conductivity yombane. Ukuba isakhiwo esisesikweni sisetyenzisiweyo, kwelinye icala, siya kuzisa iingxaki ezichasene ne-static, kwaye ngakolunye uhlangothi, ukutshatyalaliswa kobushushu kuya kuba yingxaki enkulu phantsi kweemeko eziphezulu zangoku. Ngexesha elifanayo, ngenxa ye-electrode efanelekileyo ejongene phezulu, iya kuthintela ukukhanya kunye nokunciphisa ukukhanya okukhanyayo. Amandla aphezulu okukhanya okuluhlaza ii-LEDs zinokufezekisa ukukhanya okusebenzayo ngakumbi ngetekhnoloji ye-chip flip kuneendlela zokupakisha zemveli.
Indlela yangoku yolwakhiwo oluguquliweyo kukuqala ukulungiselela iitshiphusi ze-LED ezinobungakanani obukhulu obuluhlaza kunye ne-eutectic welding electrode ezifanelekileyo, kwaye kwangaxeshanye, ulungise i-silicon substrate enkulu kancinci kunokukhanya okuluhlaza kwe-chip ye-LED, kwaye ngaphezulu kwayo, yenza umaleko wegolide we-eutectic welding kunye ne-lead out layer (i-ultrasonic gold wire ball solder joint). Emva koko, iitshiphusi ze-LED ezinamandla aphezulu zithengiswa kunye ne-silicon substrates zisebenzisa izixhobo ze-eutectic welding.
Uphawu lwesi sakhiwo kukuba i-epitaxial layer iqhagamshelana ngokuthe ngqo ne-silicon substrate, kwaye ukuxhathisa kwe-thermal ye-silicon substrate iphantsi kakhulu kune-sapphire substrate, ngoko ke ingxaki yokutshatyalaliswa kobushushu ixazululwe kakuhle. Ngenxa yokuba i-sapphire substrate ijonge phezulu emva kokuguqulwa, ibe yindawo ekhuphayo, isafire ibonakala ngokucacileyo, ngaloo ndlela isombulula ingxaki yokukhupha ukukhanya. Oku ngasentla kulwazi olufanelekileyo lweteknoloji ye-LED. Ndiyakholelwa ukuba ngophuhliso lwesayensi kunye nobuchwepheshe,Izibane ze-LEDziya kusebenza ngakumbi nangakumbi kwixesha elizayo, kwaye ubomi babo benkonzo buya kuphuculwa kakhulu, nto leyo esizisela lula ngakumbi.