Yintoni iled chip? Ngoko ke zithini iimpawu zayo? Ukwenziwa kwetshiphu ye-LED ubukhulu becala kukwenza ii-electrode zoqhagamshelwano ze-ohmic ezisebenzayo nezithembekileyo, ukuhlangabezana nokuhla kwamandla ombane amancinci phakathi kwemathiriyeli enokuqhagamshelwana nayo, ukubonelela ngeepadi zoxinzelelo lweengcingo zokuwelda, kunye nokukhupha ukukhanya kangangoko kunokwenzeka. Inkqubo yenguqu yefilimu ngokuqhelekileyo isebenzisa indlela yokukhupha ivacuum. Ngaphantsi kwe-vacuum ephezulu ye-4pa, izinto ziyanyibilika ngokufudumeza kokumelana okanye indlela yokufudumala ye-electron beam bombardment, kwaye i-bZX79C18 iba ngumphunga wesinyithi kwaye ifakwe kumphezulu wezinto ze-semiconductor phantsi koxinzelelo oluphantsi.

Ngokuqhelekileyo, i-p-type contact metal esetyenzisiweyo iquka i-Aube, i-auzn kunye nezinye i-alloys, kunye ne-n-side contact metal isoloko ithatha i-AuGeNi ialloy. Uluhlu loqhagamshelwano lwe-electrode kunye ne-alloy layer eveziweyo inokuhlangabezana ngokufanelekileyo neemfuno zenkqubo ye-lithography. Emva kwenkqubo ye-photolithography, kwakhona ngenkqubo yokubambisana, edla ngokuqhutyelwa phantsi kokhuseleko lwe-H2 okanye i-N2. Ixesha le-alloying kunye neqondo lokushisa lidla ngokugqitywa ngokweempawu zezixhobo ze-semiconductor kunye nefom yesithando somlilo se-alloy. Ngokuqinisekileyo, ukuba inkqubo ye-electrode ye-chip efana ne-blue and green inzima kakhulu, ukukhula kwefilimu ye-passive kunye nenkqubo ye-plasma etching kufuneka yongezwe.

Kwinkqubo yokuvelisa i-chip ye-LED, yiyiphi inkqubo enempembelelo ebalulekileyo ekusebenzeni kwayo kwe-photoelectric?

Ngokuqhelekileyo, emva kokugqitywa kweUkuveliswa kwe-LED epitaxial, iipropati zayo eziphambili zombane zigqitywe, kwaye ukuveliswa kwetshiphu akuyi kutshintsha indalo yayo yenyukliya, kodwa iimeko ezingafanelekanga kwinkqubo yokugquma kunye nokudibanisa kuya kubangela ezinye iiparameters ezimbi zombane. Umzekelo, ubushushu obuphantsi okanye obuphezulu be-alloying buya kubangela ukunxibelelana kwe-ohmic embi, esona sizathu siphambili sokuhla kwamandla ombane aphezulu we-VF kwimveliso yetshiphu. Emva kokusika, ukuba ezinye iinkqubo ze-corrosion zenziwa kumda we-chip, kuya kuba luncedo ukuphucula ukuvuza kwe-reverse ye-chip. Oku kungenxa yokuba emva kokusika ngentsimbi yevili lokusila idayimane, inkunkuma eninzi kunye nomgubo uya kuhlala kumda wetshiphu. Ukuba ezi zibambekile kwi-PN junction ye-chip ye-LED, ziya kubangela ukuvuza kombane kunye nokuphuka. Ukongeza, ukuba i-photoresist kwi-chip surface ayihluthwanga icocekile, iya kubangela ubunzima phambi kwe-welding kunye ne-welding yobuxoki. Ukuba isemva, iya kubangela ukuhla koxinzelelo oluphezulu. Kwinkqubo yokuveliswa kwe-chip, ukukhanya kokukhanya kunokuphuculwa ngokukrazula umphezulu kunye nokwahlula kwisakhiwo se-trapezoidal esiguquliweyo.

Kutheni le nto iitshiphusi ze-LED kufuneka zahlulwe ngokweesayizi ezahlukeneyo? Ziziphi iimpembelelo zobungakanani ekusebenzeni kwe-photoelectric ye-LED?

Ubungakanani be-chip ye-LED bunokwahlulwa ibe yi-chip yamandla aphantsi, i-chip yamandla aphakathi kunye ne-high-power chip ngokwamandla. Ngokweemfuno zabathengi, inokwahlulwa ibe kwinqanaba letyhubhu enye, inqanaba ledijithali, inqanaba le-matrix yamachaphaza kunye nokukhanya okuhombisa. Ngokubhekiselele kubungakanani obuthile be-chip, kumiselwa ngokwenqanaba lokwenyani lemveliso yabenzi be-chip abahlukeneyo, kwaye akukho mfuneko ithile. Ngethuba nje inkqubo idlula, i-chip inokuphucula imveliso yeyunithi kunye nokunciphisa iindleko, kwaye ukusebenza kweefoto zombane akuyi kutshintsha ngokusisiseko. Ukusetyenziswa kwangoku kwetshiphu eneneni inxulumene noxinaniso lwangoku oluhamba ngechip. Xa i-chip incinci, ukusetyenziswa kwangoku kuncinci, kwaye xa i-chip inkulu, ukusetyenziswa kwangoku kukhulu. Uxinaniso lwangoku lweyunithi ngokusisiseko luyafana. Ukuqwalasela ukuba ukutshatyalaliswa kobushushu kuyingxaki ephambili phantsi kwangoku ophezulu, ukusebenza kwayo okukhanyayo kuphantsi kunoko kuphantsi. Ngakolunye uhlangothi, njengoko ummandla ukhula, ukuchasana komzimba we-chip kuya kuncipha, ngoko ukuqhubela phambili kwi-voltage kuya kuncipha.

Yiyiphi indawo ye-chip ye-LED ephezulu yamandla? Ngoba?

Iitshiphusi ezine-LED ezinamandla aphezulukuba ukukhanya okumhlophe ngokubanzi malunga 40mil kwimarike. Oko kubizwa ngokuba kukusetyenziswa kwamandla eetshiphusi zamandla aphezulu ngokubanzi kubhekisa kumandla ombane angaphezu kwe-1W. Ekubeni ukusebenza kakuhle kwe-quantum ngokuqhelekileyo kungaphantsi kwe-20%, ininzi yamandla ombane iya kuguqulwa ibe amandla okushisa, ngoko ke ukuchithwa kobushushu be-chips ephezulu kubaluleke kakhulu, kwaye i-chip iyadingeka ukuba ibe nommandla omkhulu.

Ziziphi iimfuno ezahlukeneyo zeteknoloji ye-chip kunye nezixhobo zokusebenza zokuvelisa izinto ze-GaN epitaxial xa kuthelekiswa ne-gap, i-GaAs kunye ne-InGaAlP? Ngoba?

Ii-substrates ze-LED eziqhelekileyo ezibomvu kunye ne-yellow chips kunye ne-Quad eqaqambileyo ebomvu kunye ne-yellow chips zenziwe ngezinto eziphathekayo ze-semiconductor ezifana ne-gap kunye ne-GaAs, enokuthi yenziwe ngokubanzi kwi-n-type substrates. Inkqubo emanzi isetyenziselwa i-lithography, kwaye intsimbi yevili lokusila idayimani isetyenziselwa ukusika itshiphu. I-chip eluhlaza okwesibhakabhaka yezinto ze-GaN yi-sapphire substrate. Ngenxa yokuba i-sapphire substrate ifakwe kwi-insulated, ayikwazi ukusetyenziswa njengepali enye ye-LED. Kuyimfuneko ukwenza i-p / N electrode kwindawo ye-epitaxial ngexesha elifanayo ngokusebenzisa inkqubo yokucima okomileyo, kunye neenkqubo ezithile zokugqithisa. Ngenxa yokuba isafire inzima kakhulu, kunzima ukuzoba iitshiphusi ezinevili levili lokusila idayimane. Inkqubo yayo yezobuchwepheshe ngokubanzi kwaye inzima kuneye-LED eyenziwe nge-gap kunye ne-GaAs materials.

Yintoni isakhiwo kunye neempawu ze-chip "i-electrode ecacileyo"?

I-electrode ebizwa ngokuba yi-transparent electrode kufuneka iqhube kwaye ibonakale. Esi sixhobo ngoku sisetyenziswa ngokubanzi kwinkqubo yokuvelisa ikristale yolwelo. Igama layo yi-indium tin oxide, efinyeziweyo njenge-ITO, kodwa ayinakusetyenziswa njengephedi ye-solder. Ngexesha lokwenziwa, i-electrode ye-ohmic iya kwenziwa phezu komphezulu we-chip, emva koko umaleko we-ITO uya kugqunywa phezu komhlaba, kwaye emva koko umgca we-welding pad uya kufakwa kwi-TO surface. Ngale ndlela, i-current evela kwi-lead ihanjiswa ngokulinganayo kwi-electrode nganye yoqhagamshelwano lwe-ohmic ngokusebenzisa i-ITO layer. Ngelo xesha, ngenxa yokuba i-index refractive ye-ITO iphakathi kwe-index refractive ye-air kunye ne-epitaxial material, i-angle yokukhanya ingaphuculwa kwaye i-flux ekhanyayo inokunyuswa.

Yintoni eyona nto iphambili yetekhnoloji ye-chip yokukhanyisa kwe-semiconductor?

Ngophuhliso lweteknoloji ye-LED ye-semiconductor, ukusetyenziswa kwayo kwintsimi yokukhanyisa kuninzi ngakumbi, ngakumbi ukuvela kwe-LED emhlophe ibe yindawo eshushu yokukhanyisa i-semiconductor. Nangona kunjalo, i-chip engundoqo kunye neteknoloji yokupakisha kufuneka iphuculwe. Ngokubhekiselele kwi-chip, kufuneka siphuhlise ukuya kumandla aphezulu, ukusebenza kakuhle okukhanyayo kunye nokunciphisa ukuxhathisa kwe-thermal. Ukwandisa amandla kuthetha ukuba ukusetyenziswa kwangoku kwe-chip kwandiswa. Indlela ethe ngqo kukwandisa ubungakanani betshiphu. Ngoku ii-chips eziqhelekileyo zamandla aphezulu ziyi-1mm × 1mm okanye kunjalo, kwaye ukusebenza ngoku yi-350mA Ngenxa yokunyuka kokusetyenziswa kwangoku, ingxaki yokutshatyalaliswa kobushushu ibe yingxaki evelele. Ngoku le ngxaki isonjululwe ngendlela ye-chip flip. Ngokuphuhliswa kobuchwepheshe be-LED, ukusetyenziswa kwayo kwintsimi yokukhanyisa kuya kujongana nethuba elingakaze libonwe ngaphambili kunye nomngeni.

Yintoni iflip chip? Siyintoni isakhiwo sayo? Ziziphi iingenelo zayo?

I-LED eluhlaza okwesibhakabhaka idla ngokuthatha i-Al2O3 substrate. I-Al2O3 substrate inobunzima obuphezulu kunye ne-thermal conductivity ephantsi. Ukuba ithatha isakhiwo esisemthethweni, kwelinye icala, iya kuzisa iingxaki ezichasene ne-static; kwelinye icala, ukutshatyalaliswa kobushushu kuya kuba yingxaki enkulu phantsi kwangoku ophezulu. Ngelo xesha, ngenxa yokuba i-electrode yangaphambili iphezulu, ukukhanya okunye kuya kuvalwa, kwaye ukukhanya okukhanyayo kuya kuncitshiswa. Amandla aphezulu aluhlaza we-LED anokufumana ukukhanya okusebenzayo ngakumbi ngetekhnoloji ye-chip flip chip kuneteknoloji yokupakisha yemveli.

Okwangoku, indlela yolwakhiwo lwe-chip ye-flip yesiqhelo yile: okokuqala, lungiselela i-chip ye-LED enobungakanani obukhulu obuluhlaza kunye ne-eutectic welding electrode, lungisa i-silicon substrate enkulu kancinane kune-chip ye-LED eluhlaza, kwaye wenze umaleko wegolide kunye nokukhokelela ngaphandle kocingo ( I-ultrasonic yegolide yegolide yebhola ye-solder joint) ye-eutectic welding kuyo. Emva koko, i-chip ye-LED enamandla aphezulu kunye ne-silicon substrate idityaniswe kunye ngezixhobo ze-eutectic welding.

Uphawu lwesi sakhiwo kukuba i-epitaxial layer idibanisa ngokuthe ngqo ne-silicon substrate, kwaye ukuxhathisa kwe-thermal ye-silicon substrate iphantsi kakhulu kune-sapphire substrate, ngoko ke ingxaki yokutshatyalaliswa kobushushu ixazululwe kakuhle. Ngenxa yokuba i-sapphire substrate ijonge phezulu emva kokunyuka kwe-flip, iba yindawo ekhupha ukukhanya, kwaye isafire iyabonakala, ngoko ke ingxaki yokukhupha ukukhanya iyasonjululwa. Oku ngasentla kulwazi olufanelekileyo lweteknoloji ye-LED. Ndiyakholelwa ukuba ngophuhliso lwesayensi kunye nobuchwepheshe, izibane ze-LED ezizayo ziya kuba zisebenza ngakumbi nangakumbi, kwaye ubomi benkonzo buya kuphuculwa kakhulu, okuya kusizisa lula.