KubaUkukhanya kwe-LED-i-chips ezikhuphayo, usebenzisa iteknoloji efanayo, amandla aphezulu e-LED enye, ukukhanya okuphantsi kokukhanya, kodwa kunokunciphisa inani lezibane ezisetyenzisiweyo, ezilungele ukonga iindleko; Okukhona kuncinci amandla e-LED enye, kokukhona iphezulu ukusebenza kakuhle okukhanyayo. Nangona kunjalo, inani le-LED ezifunekayo kwisibane ngasinye liyakhula, ubungakanani bomzimba wesibane buyanda, kwaye ubunzima boyilo lwe-lens optical ukwanda, okuya kuba nefuthe elibi kwi-curve yokusabalalisa ukukhanya. Ngokusekwe kwizinto ezibanzi, i-LED ene-350mA esebenza ngokulinganayo kunye namandla e-1W idla ngokusetyenziswa.

Kwangaxeshanye, itekhnoloji yokupakisha nayo iyipharamitha ebalulekileyo echaphazela ukukhanya kwe-chips ze-LED. Ipharamitha yokumelana ne-thermal yomthombo wokukhanya we-LED ibonakalisa ngokuthe ngqo inqanaba letekhnoloji yokupakisha. Itekhnoloji engcono yokuchitha ubushushu, isezantsi ukuxhathisa kwe-thermal, ukucutha ukukhanya okuncinci, ukukhanya okuphezulu kunye nobomi besibane.

Ngokubhekiselele kwimpumelelo yetekhnoloji yangoku, ukuba ukukhanya okukhanyayo komthombo wokukhanya kwe-LED kufuna ukufikelela kwiimfuno zamawaka okanye amashumi amawaka e-lumens, i-chip eyodwa ye-LED ayinakuyifumana. Ukuze kuhlangatyezwane nemfuno yokukhanya kokukhanya, umthombo wokukhanya weechips ezininzi ze-LED udityaniswe kwisibane esinye ukuhlangabezana nokukhanya okuphezulu. Injongo yokukhanya okuphezulu kunokufezekiswa ngokuphucula ukusebenza kakuhle okukhanyayo kwe-LED, ukwamkela ukupakishwa okuphezulu kokukhanya okukhanyayo kunye nokuphezulu kwangoku ngokusebenzisa i-multi-chip-scale enkulu.

Kukho iindlela ezimbini eziphambili zokutshatyalaliswa kobushushu kwiitshiphu ze-LED, ezizezi, ukuqhuba ubushushu kunye nokuhanjiswa kobushushu. Ubume bokutshatyalaliswa kobushushu beIzibane ze-LEDibandakanya isiseko sobushushu kunye neradiyetha. Ipleyiti yokufunxa inokuqonda ubushushu obuphezulu bobushushu bokuhambisa ubushushu kunye nokusombulula ingxaki yokuphelisa ubushushuamandla aphezulu e-LED. Ipleyiti yokumanzisa ingumngxuma wokufunxa kunye ne-micro-structure kudonga lwangaphakathi. Xa ubushushu bufuduswa ukusuka kumthombo wobushushu ukuya kwindawo yokuphuphuma komphunga, isithuba esisebenzayo kumngxunya siya kuvelisa isenzeko segasification yesigaba solwelo kwindawo ephantsi yokufunxa. Ngeli xesha, i-medium ithatha ukushisa kwaye umthamo uyanda ngokukhawuleza, kwaye i-gas phase medium izakuzalisa ngokukhawuleza i-cavity yonke. Xa i-gas-phase medium idibanisa indawo ebanda kakhulu, ukunyuswa kuya kwenzeka, ukukhulula ubushushu obuqokelelwe ngexesha lokuphuma komphunga, kunye ne-condensed liquid medium iya kubuyela kumthombo wobushushu ophuma kwi-microstructure.

Iindlela ezisetyenziswa ngokuqhelekileyo amandla aphezulu ee-chips ze-LED zezi: ukwandiswa kwetshiphu, ukuphuculwa kokusebenza okukhanyayo, ukupakishwa ngokukhanya okuphezulu, kunye nobukhulu bangoku. Nangona inani le-luminescence yangoku liya kwanda ngokulinganayo, inani lobushushu liya kwanda. Ukusetyenziswa kwe-conductivity ephezulu ye-thermal ye-ceramic okanye isakhiwo sokupakisha i-resin yensimbi inokusombulula ingxaki yokutshatyalaliswa kobushushu kunye nokuqinisa iimpawu zokuqala zombane, i-optical and thermal. Ukuze kuphuculwe amandla ezibane ze-LED, ukusebenza kwangoku kwee-chips ze-LED kunokunyuswa. Indlela ethe ngqo yokwandisa ukusebenza kwangoku kukwandisa ubungakanani bee-chips ze-LED. Nangona kunjalo, ngenxa yokwanda komsebenzi wangoku, ukutshatyalaliswa kobushushu kuye kwaba yingxaki ebalulekileyo. Ukuphuculwa kwendlela yokupakisha yee-chips ze-LED kunokusombulula ingxaki yokutshatyalaliswa kobushushu.