KubaIichips ze-LED ezikhupha ukukhanya, usebenzisa itekhnoloji efanayo, amandla aphezulu e-LED enye, kokukhona ukuncipha kokukhanya kokukhanya. Nangona kunjalo, inokunciphisa inani lezibane ezisetyenzisiweyo, eziluncedo ekugcinweni kweendleko; Okukhona kuncinci amandla e-LED enye, kokukhona kuphezulu ukukhanya kokukhanya. Nangona kunjalo, njengoko inani le-LED ezifunekayo kwisibane ngasinye landa, ubukhulu bomzimba wesibane buyakhula, kwaye ubunzima boyilo lwe-lens optical buyanda, obunokuba nemiphumo emibi kwi-curve yokusabalalisa ukukhanya. Ngokusekelwe kwimiba ebanzi, i-LED enye enomlinganiselo osebenzayo wangoku we-350mA kunye namandla e-1W idla ngokusetyenziswa.

Ngelo xesha, iteknoloji yokupakisha nayo iparameter ebalulekileyo echaphazela ukukhanya kwee-chips ze-LED, kunye nemilinganiselo yokumelana nokushisa kwemithombo yokukhanya ye-LED ibonisa ngokuthe ngqo inqanaba lobugcisa bokupakisha. Okukhona itekhnoloji yokuphelisa ubushushu ibhetele, kokukhona ukuxhathisa kwe-thermal kusezantsi, kokukhona kuncitshiswa ukukhanya, kokukhona kuqaqamba ngakumbi isibane, kwaye kokukhona ubomi baso bubude.

Ngokubhekiselele kwimpumelelo yetekhnoloji yangoku, akunakwenzeka ukuba i-chip eyodwa ye-LED ifezekise ukukhanya okukhanyayo kwamawaka okanye amashumi amawaka e-lumens kwimithombo yokukhanya ye-LED. Ukuhlangabezana nemfuno yokukhanya okupheleleyo kokukhanya, imithombo yokukhanya ye-chip ye-LED emininzi iye yadityaniswa kwisibane esinye ukuhlangabezana neemfuno zokukhanya okuphezulu. Ngokunyusa iitshiphusi ezininzi, ukuphuculaUkuphumelela okukhanyayo kwe-LED, ukwamkela ukupakishwa kokukhanya okuphezulu, kunye nokuguqulwa okuphezulu kwangoku, injongo yokukhanya okuphezulu inokufezekiswa.

Kukho iindlela ezimbini eziphambili zokupholisa iitshiphusi ze-LED, ezizezi, ukuhanjiswa kwe-thermal kunye ne-thermal convection. Ubume bokutshatyalaliswa kobushushu beUkukhanya kwe-LEDizixhobo ezibandakanya isiseko sobushushu kunye nesitya sobushushu. Ipleyiti yokuntywila inokufikelela kwi-ultra-high heat flux density density transfer heat kunye nokusombulula ingxaki yokutshatyalaliswa kobushushu kwii-LEDs zamandla aphezulu. Ipleyiti yokuntywila yindlu yokucoca ene-microstructure eludongeni lwangaphakathi. Xa ubushushu bufuduswa ukusuka kumthombo wobushushu ukuya kwindawo yokuphuphuma, indawo yokusebenza ngaphakathi kwegumbi ifumana i-gasification yesigaba solwelo kwindawo ephantsi yevacuum. Ngeli xesha, i-medium ithatha ukushisa kwaye ikhulise ngokukhawuleza umthamo, kwaye i-gas-phase medium igcwalisa ngokukhawuleza igumbi lonke. Xa i-gas-phase medium idibana nommandla obandayo, i-condensation iyenzeka, ikhuphe ubushushu obuqokelelwe ngexesha lokuphuma kwamanzi. Isigaba solwelo olujikisiweyo oluphakathi luya kubuya ukusuka kwi-microstructure ukuya kumthombo wobushushu obuphuphumayo.

Iindlela eziqhele ukusetyenziswa ngamandla aphezulu kwiitshiphusi ze-LED zezi: ukukala kwetshiphu, ukuphucula ukusebenza kakuhle okukhanyayo, ukusebenzisa ukupakishwa kokukhanya okuphezulu, kunye noguqulo oluphezulu lwangoku. Nangona isixa sangoku esikhutshwa yile ndlela siya kunyuka ngokulinganayo, isixa sobushushu obuveliswayo siya kwanda ngokufanelekileyo. Ukutshintshela kwi-thermal conductivity ye-ceramic okanye i-metal resin yokupakisha isakhiwo kunokusombulula ingxaki yokutshatyalaliswa kobushushu kunye nokuphucula iimpawu zokuqala zombane, i-optical, kunye ne-thermal. Ukwandisa amandla okukhanyisa izibane ze-LED, ukusebenza kwangoku kwe-chip ye-LED kunokunyuswa. Indlela ethe ngqo yokwandisa ukusebenza ngoku kukunyusa ubungakanani be-chip ye-LED. Nangona kunjalo, ngenxa yokwanda kokusebenza kwangoku, ukutshatyalaliswa kobushushu kuye kwaba ngumba obalulekileyo, kwaye ukuphuculwa kokupakishwa kwee-chips ze-LED kunokusombulula ingxaki yokutshatyalaliswa kobushushu.