KubaIichips ze-LED ezikhupha ukukhanya, usebenzisa itekhnoloji efanayo, amandla aphezulu e-LED enye, kokukhona ukuncipha kokukhanya kokukhanya.Nangona kunjalo, inokunciphisa inani lezibane ezisetyenzisiweyo, eziluncedo ekugcinweni kweendleko;Okukhona kuncinci amandla e-LED enye, kokukhona kuphezulu ukukhanya kokukhanya.Nangona kunjalo, njengoko inani le-LED ezifunekayo kwisibane ngasinye sanda, ubukhulu bomzimba wesibane buyakhula, kwaye ubunzima boyilo lwe-lens optical buyanda, obunokuba nemiphumo emibi kwi-curve yokusabalalisa ukukhanya.Ngokusekelwe kwimiba ebanzi, i-LED enye enomlinganiselo osebenzayo ngoku we-350mA kunye namandla e-1W idla ngokusetyenziswa.

Ngelo xesha, iteknoloji yokupakisha nayo iparameter ebalulekileyo echaphazela ukukhanya kwee-chips ze-LED, kunye nemilinganiselo yokumelana nokushisa kwemithombo yokukhanya ye-LED ibonisa ngokuthe ngqo inqanaba lobugcisa bokupakisha.Okukhona iteknoloji yokuphelisa ubushushu ibhetele, kokukhona ukuxhathisa kwe-thermal kusezantsi, kokukhona kuncitshiswa ukukhanya, kokukhona kuqaqamba ngakumbi isibane, kwaye kokukhona ubomi baso bubude.

Ngokubhekiselele kwimpumelelo yetekhnoloji yangoku, akunakwenzeka ukuba i-chip eyodwa ye-LED ifezekise ukukhanya okukhanyayo kwamawaka okanye amashumi amawaka e-lumens kwimithombo yokukhanya ye-LED.Ukuhlangabezana nemfuno yokukhanya okupheleleyo kokukhanya, imithombo yokukhanya ye-chip ye-LED emininzi iye yadityaniswa kwisibane esinye ukuhlangabezana neemfuno zokukhanya okuphezulu.Ngokunyusa iitshiphusi ezininzi, ukuphuculaUkuphumelela okukhanyayo kwe-LED, ukwamkela ukupakishwa kokukhanya okuphezulu, kunye nokuguqulwa okuphezulu kwangoku, injongo yokukhanya okuphezulu inokufezekiswa.

Kukho iindlela ezimbini eziphambili zokupholisa iitshiphusi ze-LED, ezizezi, ukuhanjiswa kwe-thermal kunye ne-thermal convection.Ubume bokutshatyalaliswa kobushushu beUkukhanya kwe-LEDizixhobo ezibandakanya isiseko sobushushu kunye nesitya sobushushu.Ipleyiti yokuntywila inokufikelela kwi-ultra-high heat flux density density transfer heat kunye nokusombulula ingxaki yokutshatyalaliswa kobushushu kwii-LEDs zamandla aphezulu.Ipleyiti yokuntywila yindlu yokucoca ene-microstructure eludongeni lwangaphakathi.Xa ubushushu bufuduswa ukusuka kumthombo wobushushu ukuya kwindawo yokuphuphuma, indawo yokusebenza ngaphakathi kwegumbi ifumana i-gasification yesigaba solwelo kwindawo ephantsi yevacuum.Ngeli xesha, i-medium ithatha ukushisa kwaye ikhulise ngokukhawuleza umthamo, kwaye i-gas-phase medium igcwalisa ngokukhawuleza igumbi lonke.Xa i-gas-phase medium idibana nommandla obandayo, i-condensation iyenzeka, ikhuphe ubushushu obuqokelelwe ngexesha lokuphuma kwamanzi.Isigaba solwelo olujikisiweyo oluphakathi luya kubuya ukusuka kwi-microstructure ukuya kumthombo wobushushu obuphuphumayo.

Iindlela eziqhele ukusetyenziswa ngamandla aphezulu kwiitshiphusi ze-LED zezi: ukukala kwetshiphu, ukuphucula ukusebenza kakuhle okukhanyayo, ukusebenzisa ukupakishwa kokukhanya okuphezulu, kunye noguqulo oluphezulu lwangoku.Nangona isixa sangoku esikhutshwa yile ndlela siya kunyuka ngokulinganayo, isixa sobushushu obuveliswayo siya kwanda ngokufanelekileyo.Ukutshintshela kwi-thermal conductivity ye-ceramic okanye i-metal resin yokupakisha isakhiwo kunokusombulula ingxaki yokutshatyalaliswa kobushushu kunye nokuphucula iimpawu zokuqala zombane, i-optical, kunye ne-thermal.Ukwandisa amandla okukhanyisa izibane ze-LED, ukusebenza kwangoku kwe-chip ye-LED kunokunyuswa.Indlela ethe ngqo yokwandisa ukusebenza ngoku kukunyusa ubungakanani be-chip ye-LED.Nangona kunjalo, ngenxa yokwanda kokusebenza kwangoku, ukutshatyalaliswa kobushushu kuye kwaba ngumba obalulekileyo, kwaye ukuphuculwa kokupakishwa kwee-chips ze-LED kunokusombulula ingxaki yokutshatyalaliswa kobushushu.